3D IC Stacking Technology by Banqiu Wu, Ajay Kumar, Sesh Ramaswami

By Banqiu Wu, Ajay Kumar, Sesh Ramaswami

The newest advances in three-d built-in circuit stacking technology

With a spotlight on business purposes, 3D IC Stacking Technology bargains entire assurance of layout, try, and fabrication processing equipment for third-dimensional machine integration. every one bankruptcy during this authoritative consultant is written via specialists and info a separate fabrication step. destiny functions and state of the art layout strength also are mentioned. this can be an important source for semiconductor engineers and transportable equipment designers.

3D IC Stacking Technology covers:

  • High density via silicon stacking (TSS) technology
  • Practical layout surroundings for heterogeneous 3D IC products
  • Design automation and TCAD device recommendations for via silicon through (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper...
  • Show description

    Read Online or Download 3D IC Stacking Technology PDF

    Similar semiconductors books

    Concepts in Spin Electronics

    These days details know-how relies on semiconductor and feromagnetic fabrics. details processing and computation are in accordance with electron cost in semiconductor transistors and built-in circuits, and data is kept on magnetic high-density demanding disks in keeping with the physics of the electron spins.

    Printed Circuits Handbook

    Руководство по печатным платамThe up-to-date published Circuits instruction manual will give you: Unsurpassed information on published circuits from layout to production. Over 500 illustrations, charts, and tables for fast entry to crucial info. New to this version: New assurance of lead-free PCB layout and production concepts, lead-free fabrics, lead-free reliability versions, most sensible practices for top Density Interconnect (HDI), and versatile revealed circuits.

    Latchup in CMOS Technology: The Problem and Its Cure

    Why a e-book on Iatchup? Latchup has been, and is still, a in all likelihood critical CMOS reliability problem. This obstacle is turning into extra common with the ascendency of CMOS because the dominant VLSI expertise, relatively as parasitic bipolar features proceed to enhance at ever smaller dimensions on silicon wafers with ever reduce disorder densities.

    Glancing Angle Deposition of Thin Films: Engineering the Nanoscale

    This ebook offers a hugely functional remedy of pleased expertise, accumulating present systems, methodologies, and experimental designs right into a unmarried, cohesive quantity that allows you to be beneficial either as a prepared reference for these within the box and as a definitive advisor for these getting into it. It covers:History and improvement of joyful techniquesProperties and Characterization of blissful fabricated filmsDesign and engineering of optical pleased motion pictures together with fabrication and testingPost-deposition processing and integrationDeposition platforms for comfortable fabricationAlso features a patent survey of correct literature and a survey of GLAD’s wide variety of fabric houses and numerous functions.

    Additional resources for 3D IC Stacking Technology

    Example text

    A unique opportunity for wafer-to-wafer (W2W) assembly can be considered if both die are identical in size, which might apply for memory stacking. The optimum flow choice for TSS fabrication and assembly will be determined by cost, yield, test strategy, and reliability considerations for specific applications. As TSS moves to stacking of more than two dies, a combination of these flows might be considered for the different tiers in the stack to attain optimum results. 14 Die-to-substrate or die-to-die flow.

    In Chap. 2, Radojcic from Qualcomm provides insight into the design eco-system for heterogeneous 3D IC products. This naturally flows into a foundational chapter by Kawa et al. from Synopsys on the topic of design automation and TCAD tool solutions required to enable chip design. In Chap. 4, Ramaswami from Applied Materials articulates TSV options, identifies process integration challenges, and showcases solutions to enable TSV technology. The subsequent five chapters, contributed by colleagues from Applied Materials, provide a portal into the fundamentals and intricacies of TSV-related unit processes.

    Another example of the disruptive potential of 3D memory stacking is an 80-processor core demonstrator chip reported by Intel in which each core has a local 2-MB SRAM block for data and instruction storage stacked above, using TSS. The configuration provides a total of 1TB/second of bandwidth to the processor cores for teraflop computation [13]. 6 billion people, or approximately one-quarter of the world’s population, used the Internet in 2009, and that will increase to more than 2 billion by 2013 as Internet access shifts to wireless mobile [14].

    Download PDF sample

    Rated 4.09 of 5 – based on 36 votes