By Banqiu Wu, Ajay Kumar, Sesh Ramaswami
The newest advances in three-d built-in circuit stacking technology
With a spotlight on business purposes, 3D IC Stacking Technology bargains entire assurance of layout, try, and fabrication processing equipment for third-dimensional machine integration. every one bankruptcy during this authoritative consultant is written via specialists and info a separate fabrication step. destiny functions and state of the art layout strength also are mentioned. this can be an important source for semiconductor engineers and transportable equipment designers.
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A unique opportunity for wafer-to-wafer (W2W) assembly can be considered if both die are identical in size, which might apply for memory stacking. The optimum flow choice for TSS fabrication and assembly will be determined by cost, yield, test strategy, and reliability considerations for specific applications. As TSS moves to stacking of more than two dies, a combination of these flows might be considered for the different tiers in the stack to attain optimum results. 14 Die-to-substrate or die-to-die flow.
In Chap. 2, Radojcic from Qualcomm provides insight into the design eco-system for heterogeneous 3D IC products. This naturally flows into a foundational chapter by Kawa et al. from Synopsys on the topic of design automation and TCAD tool solutions required to enable chip design. In Chap. 4, Ramaswami from Applied Materials articulates TSV options, identifies process integration challenges, and showcases solutions to enable TSV technology. The subsequent five chapters, contributed by colleagues from Applied Materials, provide a portal into the fundamentals and intricacies of TSV-related unit processes.
Another example of the disruptive potential of 3D memory stacking is an 80-processor core demonstrator chip reported by Intel in which each core has a local 2-MB SRAM block for data and instruction storage stacked above, using TSS. The configuration provides a total of 1TB/second of bandwidth to the processor cores for teraflop computation . 6 billion people, or approximately one-quarter of the world’s population, used the Internet in 2009, and that will increase to more than 2 billion by 2013 as Internet access shifts to wireless mobile .